Gyeon Q²M Compound Plus (Αλοιφή Γυαλίσματος)

Gyeon Q²M Compound+ Polishing Paste GYEON Q2M COMPOUND+ is a heavy duty cutting paste that offers improved scratch removal and high friction with low dust and limited secondary defects. Although it leaves slight holograms, they are easily removed with one pass of Q2M POLISH. Q2M COMPOUND+ provides increased cutting power without the cost of huge defects. The formula is water-based and contains high quality Japanese abrasives that allow for quick and easy removal of defects. No silicones or fillers make the process of coating preparation and polish removal faster and easier. Work with a polishing machine of your choice (rotary, eccentric, forced rotation). Apply at low speed. Continue until completely gone at medium speed. Wipe with a HQ microfiber cloth. Use a 1:1 dilution of IPA to remove remaining product and check the result. Repeat if necessary. Available Packaging: 120 ML / 1000 ML Consumption: 15 – 40 ml/section