Gyeon Q²M Compound Plus Polishing Paste

Gyeon Q²M Compound+ Polishing Paste

GYEON Q2M COMPOUND+ is a heavy duty cutting compound that offers improved scratch removal and high friction with low dust and limited secondary defects. Although it leaves slight holograms, they are easily removed with a single pass of Q2M POLISH.

Q2M COMPOUND+ provides increased cutting power without the price of massive defects.

The formula is water-based and contains high-quality Japanese abrasives that allow for quick and easy removal of defects.

No silicone or filler makes the process of coating preparation and polish removal faster and easier. Work with a polishing machine of your choice (rotary, eccentric, forced rotation).

Apply at low speed. Continue until it disappears completely at medium speed.

Wipe with a HQ microfiber cloth.

Use a 1:1 dilution of IPA to remove the remaining product and check the result.

If necessary, repeat.

Available Packages: 120 ML / 1000 ML Consumption: 15 – 40 ml/portion